HHT Sandalwood Knife Kits for BGA Motherboard Repair (3Pcs Handle with 6Pcs Blades)

How to use BGA motherboard repair kits

1# Leaf

It is mainly used for removing of small chips and adhesive around

#2 Leaf

It is mainly used for removing of large chips and adhesive around

#3 Leaf

It is mainly used for removing of iPhone CPU and NAND,also can used for removing of CPU SDRAM

#4 Leaf

The blade is specially designed for safe removing of Android UFS/EMMC chips

The blade is elongated and flexible, which can effectively avoid the falling-off of pads when removing UFS/EMMC chips.Meanwhile, it can also prevent small components around from falling off the board during operation

#5 Leaf

It is mainly used for removing or sealing adhesive around chips

It can be used in narrow spaces and brings no damage to circuits on the board

#6 Leaf

It is mainly used for removing of chips surrounded by small components when general blades cannot be inserted horizontally under these chips

Features

● The sandalwood knife kits with ultra-thin blades will offer the best solution to pry out the chip easily without any damage.

● The BGA chip remover blade is common used disassembly tools for small and slightly smaller IC parts on the motherboard of the mobile phone.

● The sandalwood knife handle's head adopts special aluminum, the knife handle is non-slip, anti-thermal conductivity, anti-corrosion, anti-deformation.

● The sandalwood knife kits are perfect phone glue cleaning tool for iPhone motherboard and LCD screen, it can meet most of the cleaning operation on motherboard repair or cleaning.