Mijing MS1 Intelligent universal Desoldering Platform For IP X - 13 Pro Max

Brief Introduction

Four-in-one universal iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 mini/12 Pro/12 Pro Max/13/13 mini/13 Pro/13 Pro Max support A15 CPU chip, A15 HHD, iPhone 13 baseband.

Expansion Module Function

● Module A: Multifunctional Bezel Separating Expansion
For CPU chip removing, Face ID dot matrix and Touch-ID repairing
● Module B: MS1-IP 11 Series Expansion
For IP X/XS/XS Max/11 Series motherboard preheating and desoldering
● Module C: MS1-IP 12 Series Expansion
For IP 12 Series motherboard preheating and desoldering
● Module D: MS1-IP 13 Series Expansion
For IP 13 Series motherboard preheating and desoldering

Specifications of iRepair MS1

● Brand: Mijing & iRepair

● Model: MS1

● Product Name: Universal Desoldering Platform

● Main Use: Preheating/Desoldering

● Input Voltage: 110/220V (Dual gear shift with one button)

● Temperature Regulation: 50-300°

● Scope of application: Preheat soldering of electronic products and PCB

● Products include: MS1 Desoldering Platform*1, Upgrade expansion module*4